Electrodeposition from a Liquid Cationic Cuprous Organic Complex for Seed Layer Deposition
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چکیده
منابع مشابه
Seed - layer deposition Patterning Insulator deposition and patterning Seed - layer deposition Seed layer Substrate
Damascene Cu electroplating for on-chip metallization, which we conceived and developed in the early 199Os, has been central to IBM's Cu chip interconnection technology. We review here the challenges of filling trenches and vias with Cu without creating a void or seam, and the discovery that electrodeposition can be engineered to give filling performance significantly better than that achievabl...
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ژورنال
عنوان ژورنال: Journal of The Electrochemical Society
سال: 2011
ISSN: 0013-4651
DOI: 10.1149/2.035111jes